Process and system for eliminating gas bubbles during...

Details Process and system for eliminating gas bubbles during... Process and system for eliminating gas bubbles during...

2006-05-16

2006-05-16

King, Roy (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S212000, C204S237000, C204S275100, C204SDIG012, C205S098000, C205S672000

Reexamination Certificate

active

07045040

ABSTRACT:
A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is provided. The present invention employs the process solution to prevent or remove gas bubbles from the wafer surface during or before the electrochemical processing of the wafer surface. Accordingly, during the process, the wafer surface is initially brought in proximity of the surface of the process solution. Next, a process solution flow is directed towards the selected region of the wafer surface for a predetermined time. In the following step, the selected region of the wafer surface is contacted with the process solution flow for the predetermined time to prevent bubble formation, and the wafer surface is immersed into the process solution for electrochemical processing.

REFERENCES:
patent: 5327921 (1994-07-01), Mokuo et al.
patent: 6136163 (2000-10-01), Cheung et al.
patent: 6274023 (2001-08-01), Kaufman et al.
patent: 6274024 (2001-08-01), Kaufman et al.
patent: 6395101 (2002-05-01), Scranton et al.
patent: 6551487 (2003-04-01), Reid et al.
patent: 6582578 (2003-06-01), Dordi et al.
patent: 2003/0106802 (2003-06-01), Hagiwara et al.

Affiliated with

Also associated with

Rating

Process and system for eliminating gas bubbles during... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and system for eliminating gas bubbles during..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and system for eliminating gas bubbles during... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3594064