Chip-type sensor against ESD and stress damages and...

Details Chip-type sensor against ESD and stress damages and... Chip-type sensor against ESD and stress damages and...

2006-07-04

2006-07-04

Deb, Anjan (Department: 2858)

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

C324S690000

Reexamination Certificate

active

07071708

ABSTRACT:
A chip-type sensor against ESD and stress damages and contamination interference includes a substrate structure and a protection layer covering over the substrate structure. The protection layer includes, from bottom to top, a first layer for providing a first stress against the substrate structure, a second layer for providing a second stress against the substrate structure, and a third layer for providing a third stress against the substrate structure. The first stress and the third stress belong to one of a tensile stress and a compressive stress, and the second stress belongs to the other of the tensile stress and the compressive stress.

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