Molding die apparatus, method for molding disc substrate,...

Details Molding die apparatus, method for molding disc substrate,... Molding die apparatus, method for molding disc substrate,...

2006-03-07

2006-03-07

Heckenberg, Donald (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Female mold and charger to supply fluent stock under...

With product ejector

C425S443000, C425S810000

Reexamination Certificate

active

07008216

ABSTRACT:
Preventing a molded disc substrate from generating a separation pattern. To this end, a molding die1includes a pair of stationary die6and movable die7,and an outer circumference ring16for molding an outer circumference end of the disc substrate2.The outer circumference ring16is so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable die7toward the stationary die6,and has a retaining surface39for retaining the outer circumference of the molded disc substrate2.

REFERENCES:
patent: 4118168 (1978-10-01), Rees et al.
patent: 5018962 (1991-05-01), Kitamura et al.
patent: 5171585 (1992-12-01), Onisawa et al.
patent: 5427520 (1995-06-01), Shimizu et al.
patent: 0 338 906 (1989-10-01), None
patent: 08-90613 (1996-04-01), None
patent: 09-123229 (1997-05-01), None
Computer translation of Japanese Pub. No. 09-123999.
Patent Abstracts of Japan vol. 1997, No. 09, Sep. 30, 1997 & JP 09 123229 A (Sony Corp), May 13, 1997.
Patent Abstracts of Japan vol. 1996, No. 08, Aug. 30, 1996 & JP 08 090613 A (Taiyo Yuden Co Ltd), Apr. 9, 1996.

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