Solid via layer to layer interconnect

Details Solid via layer to layer interconnect Solid via layer to layer interconnect

2006-07-18

2006-07-18

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C029S846000, C156S295000, C174S262000

Reexamination Certificate

active

07076869

ABSTRACT:
The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The first via is totally filled with a first solid conductive plug and an end of the first solid conductive plug includes a first contact pad that is in contact with a surface of the first layer. A second via extending through a total thickness of a second layer is formed. The second via totally filling with a second solid conductive plug and an end of the second solid conductive plug includes a second contact pad that is in contact with a surface of the second layer. The second layer is electrically and mechanically coupled to the first layer by an electrically conductive adhesive that is in electrical and mechanical contact with both the end of the first plug and the end of the second plug.

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Multilayer Substrate With Low Coefficient of Thermal Expansion, Nakamura et al., 2000 International Symposium on Microelect, pp. 235-240.

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