Multi-layer printed circuit board and method for...

Details Multi-layer printed circuit board and method for... Multi-layer printed circuit board and method for...

2006-03-14

2006-03-14

Cuneo, K. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S794000

Reexamination Certificate

active

07012197

ABSTRACT:
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.

REFERENCES:
patent: 4931354 (1990-06-01), Wakino et al.
patent: 5403672 (1995-04-01), Urasaki et al.
patent: 6228467 (2001-05-01), Taniguchi et al.
patent: 6534723 (2003-03-01), Asai et al.
patent: 6734542 (2004-05-01), Nakatani et al.
patent: 2001/0042637 (2001-11-01), Hirose et al.
patent: A-H07-307575 (1995-11-01), None

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