Semiconductor chip pick and place process and equipment

Details Semiconductor chip pick and place process and equipment Semiconductor chip pick and place process and equipment

2006-04-18

2006-04-18

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S426100, C029S426300, C029S426500, C029S564100, C029S840000

Reexamination Certificate

active

07028396

ABSTRACT:
A process and tooling for removing a semiconductor chip (31) from a handling tape (321) without damage to either the chip or tape by one or more horizontal beam type ejector tools (333) driven by a variable speed motor (332) applying uniform pressure to the tape and chip backside. Each tool (333) emerges from a rigid support surface through an aperture which also serves to supply vacuum to hold the chip in alignment prior to ejection, and in turn allows planar removal of the chip by a pick-up arm (351).

REFERENCES:
patent: 3785507 (1974-01-01), Wiesler et al.
patent: 4476626 (1984-10-01), Gumbert et al.
patent: 4494902 (1985-01-01), Kuppens et al.
patent: 4829663 (1989-05-01), Masujima et al.
patent: 4850780 (1989-07-01), Safabakhsh et al.
patent: 4990051 (1991-02-01), Safabakhsh et al.
patent: 6190115 (2001-02-01), Suzuki et al.
patent: 6505397 (2003-01-01), Mimata et al.

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