Method of electroplating printed circuits

Details Method of electroplating printed circuits Method of electroplating printed circuits

1983-10-27

1985-04-23

Tufariello, Thomas

Chemistry: electrical and wave energy

Processes and products

204279, C25D 502

Patent

active

045128545

ABSTRACT:
A process for electroplating a printed circuit board utilizing an improved masking tape for partially covering the surfaces of the circuit board is provided. The masking tape comprises a foil-like carrier and a coating consisting of an adhesive material applied to one side of the foil-like carrier. At least one electrical conductor is arranged on the coating of the masking tape and forms a unit therewith. The electrical conductor connects the surfaces to be electroplated of the printed circuit board with one another and with a frame carried by the printed circuit board.

REFERENCES:
patent: 2834723 (1958-05-01), Robinson
patent: 4000045 (1976-12-01), Rotzow
IBM Tech. Disclosure Bulletin, vol. 2, No. 3, Oct. 1959, p. 32.

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