Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-01-10
2006-01-10
Le, Thao P. (Department: 2818)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S825000, C029S827000, C174S260000, C257S684000
Reexamination Certificate
active
06983536
ABSTRACT:
A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die. In the assembled carrier the die and interconnect are biased together by a force distribution mechanism that includes a bridge clamp, a pressure plate and a spring clip. Following testing of the die, the carrier is disassembled and the tested die is removed.
REFERENCES:
patent: 3583561 (1971-06-01), Wiesler et al.
patent: 3702025 (1972-11-01), Archer
patent: 3702923 (1972-11-01), Wiesler et al.
patent: 3785507 (1974-01-01), Wiesler et al.
patent: 3939381 (1976-02-01), Meany
patent: 4214364 (1980-07-01), St. Louis et al.
patent: 4281449 (1981-08-01), Ports et al.
patent: 4295182 (1981-10-01), Aubusson et al.
patent: 4312117 (1982-01-01), Robillard et al.
patent: 4488354 (1984-12-01), Chan et al.
patent: 4585991 (1986-04-01), Reid et al.
patent: 4618938 (1986-10-01), Sandland et al.
patent: 4656605 (1987-04-01), Clayton
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4899921 (1990-02-01), Bendat et al.
patent: 4903113 (1990-02-01), Frankeny et al.
patent: 4922378 (1990-05-01), Malhi et al.
patent: 4924589 (1990-05-01), Leedy
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4949163 (1990-08-01), Sudo et al.
patent: 4952272 (1990-08-01), Okino et al.
patent: 4963225 (1990-10-01), Lehman-Lamer
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 4985988 (1991-01-01), Littlebury
patent: 4987365 (1991-01-01), Shreeve et al.
patent: 5020999 (1991-06-01), Dewitt et al.
patent: 5072116 (1991-12-01), Kawade et al.
patent: 5072289 (1991-12-01), Sugimoto et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5093982 (1992-03-01), Gussman
patent: 5103557 (1992-04-01), Leedy
patent: 5123850 (1992-06-01), Elder et al.
patent: 5157829 (1992-10-01), Schmidt et al.
patent: 5173451 (1992-12-01), Kinsman et al.
patent: 5177438 (1993-01-01), Littlebury et al.
patent: 5177439 (1993-01-01), Liu et al.
patent: 5249450 (1993-10-01), Wood et al.
patent: 5264787 (1993-11-01), Woith et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5323035 (1994-06-01), Leedy
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5389556 (1995-02-01), Rostoker et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5539324 (1996-07-01), Wood et al.
patent: 61-5537 (1986-01-01), None
patent: 61-101067 (1986-05-01), None
patent: HEI 3-69131 (1991-03-01), None
Cloud et al., “Equipment, Processes and Methods For High Volume KGD Production,” Semicon West 1994, Montview, CA, Third Annual Manufacturing, Jul. 2, 1994, text pp. 150, 170.
Yamamoto et al., “Evaluation of New Micro-Connection System Using Microbumps,” ISHM '93 Proceedings, pp. 370-378, 1993.
Miyake et al., “Connectivity Analysis of New Known Good Die Connection Systems Using Microbumps,” Technical Paper, Mar. 22, 1993.
Packard Hughes Interconnect, “Science Over Art Our New IC Membrane Test Probe,” 1993.
Farnworth Warren
Wood Alan
Fletcher Yoder
Le Thao P.
Micro)n Technology, Inc.
LandOfFree
Method and apparatus for manufacturing known good... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for manufacturing known good..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for manufacturing known good... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3586966