Method of coating microelectronic substrates

Coating processes – Electrical product produced

Reexamination Certificate

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Details

C427S335000, C427S336000, C427S337000, C427S430100, C427S443100

Reexamination Certificate

active

06989172

ABSTRACT:
A method of coating a substrate comprises the steps of: (a) providing a substrate in an enclosed vessel, the substrate having a surface portion; (b) at least partially filling the enclosed vessel with a first supercritical fluid so that said first supercritical fluid contacts the surface portion, with the first supercritical fluid carrying or containing a coating component; then (c) adding a separate compressed gas atmosphere to the reaction vessel so that a boundary is formed between the first supercritical fluid and the separate compressed gas atmosphere, said separate compressed gas atmosphere having a density less than said first supercritical fluid; and then (d) displacing said first supercritical fluid from said vessel by continuing adding said separate compressed gas atmosphere to said vessel so that said boundary moves across said surface portion and a thin film of coating component is deposited on said microelectronic substrate.

REFERENCES:
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patent: 6083565 (2000-07-01), Carbonell et al.
patent: 6194650 (2001-02-01), Wakayama et al.
patent: 6344243 (2002-02-01), McClain et al.
patent: 6497921 (2002-12-01), Carbonell et al.
patent: 2003/0064149 (2003-04-01), Miller
patent: 2003/0165628 (2003-09-01), Simmons et al.
patent: WO 02/066176 (2002-08-01), None
Cabanas et al.,Deposition of Cu Films from Supercritical Fluids Using Cu(I)β-Diketonate Precursors, Microelectronic Engineering, 64:53-61 (2002).
International Search Report for PCT/US03/38324; Date of mailing Sep. 30, 2004.

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