Water-dispersible resin composition for use in boring hole...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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Details

C029S825000, C525S087000

Reexamination Certificate

active

07012117

ABSTRACT:
The present invention provides a water-dispersant resin composition for perforating a printed wiring board excellent in preciseness of the processing position and plating throwing power when perforating, a sheet for perforating using the composition, a process for perforating a printed wiring board using the sheet. More specifically, the present invention provides a water-dispersant resin composition for perforating a printed wiring board comprising a water-soluble polymer (A) and a polymer compound (B) containing the compound represented by the following formula (1) as a copolymer component, a sheet for perforating using the composition, and a process for perforating a printed wiring board using the sheet.(wherein, R represents hydrogen or a methyl group, and n represents an integer of 10 to 22).

REFERENCES:
patent: 6730722 (2004-05-01), Eck et al.
patent: 470757 (2002-02-01), None
patent: 4-277697 (1992-10-01), None
patent: 5-169400 (1993-07-01), None
patent: 8-197496 (1996-08-01), None

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