Wafer processing apparatus and method of use

Details Wafer processing apparatus and method of use Wafer processing apparatus and method of use

2006-03-28

2006-03-28

Fuqua, Shawntina (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S443100, C219S390000, C219S405000, C219S446100, C219S447100, C219S448170, C219S448110, C392S416000, C392S418000, C118S724000, C118S725000, C118S050100, C118S728000, C118S729000, C118S730000

Reexamination Certificate

active

07019268

ABSTRACT:
A system, apparatus, and method for thermal processing of substrates undergoing lithographic chemical processes is provided. The thermal processing system includes at least one heating element, a heat distributing plate, having a heating surface and being disposed in thermal communication with the at least one heating element. The heat distributing plate is constructed and arranged to distribute heat from the heating element onto the heating surface. A substrate support, supports a substrate at a position above the heating surface and the system includes an actuator that rotates the substrate relative to the heating surface during a heat transfer operation.

REFERENCES:
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patent: 5527393 (1996-06-01), Sato et al.
patent: 5849582 (1998-12-01), Chen et al.
patent: 6137088 (2000-10-01), Chen et al.
patent: 6221781 (2001-04-01), Siefering et al.
patent: 6307184 (2001-10-01), Womackk et al.
patent: 6329304 (2001-12-01), Kuznetsov et al.
patent: 6753508 (2004-06-01), Shirakawa

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