Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2006-03-28
2006-03-28
Wilczeweld, Mary (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S685000, C257S686000, C257S737000, C257S738000, C257S780000, C257S784000
Reexamination Certificate
active
07019397
ABSTRACT:
A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part of wiring104is formed at the side surface of a semiconductor element101, and bump electrodes102are formed so as to be nearly on a same plane as the wiring104formed at the side surface of the semiconductor element101. At least a part of ball electrodes103is formed so as to connect electrically to the wiring104at the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring104, and the confronting surface of the circuit forming surface is sealed with resin.
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Ohuchi Shinji
Shiraishi Yasushi
Tanaka Yasuo
Lewis Monica
Wilczeweld Mary
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