Electroplating cell based upon rotational plating solution flow

Details Electroplating cell based upon rotational plating solution flow Electroplating cell based upon rotational plating solution flow

2006-01-10

2006-01-10

King, Roy (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C204S275100, C205S123000, C205S148000, C427S421100

Reexamination Certificate

active

06984302

ABSTRACT:
The invention discloses a method of electroplating a material onto a semiconductor substrate. A substrate is placed in a cylindrical processing chamber enclosure. A nozzle for spraying a liquid electroplating solution opposes the top surface of the substrate. The electroplating solution flows through the nozzle and outward angularly from the tip of the nozzle, so that the solution flows rotationally on the surface of the substrate.

REFERENCES:
patent: 4151062 (1979-04-01), Norris
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4339319 (1982-07-01), Aigo
patent: 4443304 (1984-04-01), Eidschun
patent: 4906341 (1990-03-01), Yamakawa et al.
patent: 4981559 (1991-01-01), Sato et al.
patent: 5000827 (1991-03-01), Schuster et al.
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5443707 (1995-08-01), Mori
patent: 5626913 (1997-05-01), Tomoeda et al.
patent: 5830334 (1998-11-01), Kobayashi
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 6001235 (1999-12-01), Arken et al.
patent: 6042712 (2000-03-01), Mathieu
R. Byron Bird, et al, “Transport Phenomena,” 1960, pp. 219-220, Department of Chemical Engineering, University of Wisconsin, Madison, Wisconsin, John Wiley & Sons.

Affiliated with

Also associated with

Rating

Electroplating cell based upon rotational plating solution flow does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating cell based upon rotational plating solution flow, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating cell based upon rotational plating solution flow will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3583648