Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2006-04-04
2006-04-04
Von Buhr, Maria N. (Department: 2125)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
Reexamination Certificate
active
07024266
ABSTRACT:
A substrate processing apparatus includes a first chamber, a second chamber which has a first valve, a second valve and a chuck, wherein a substrate is transferred to the second chamber through the first valve, held by the chuck in the second chamber, and then transferred to the first chamber through the second valve, a pressure reduction section which reduces a pressure in the second chamber to a predetermined pressure while the substrate is held by the chuck in the second chamber, a thermoregulator which is arranged in the chuck and regulates a temperature of the substrate held by the chuck to be a predetermined temperature, and a controller which controls the pressure reduction section so as to make a relationship between the pressure in the second chamber and a pressure reduction time in the second chamber fall within a predetermined range, controls the chuck so as to make a suction force for the substrate constant, and controls the thermoregulator so as to make a temperature of the chuck constant.
REFERENCES:
patent: 4975168 (1990-12-01), Ohno et al.
patent: 5044314 (1991-09-01), McNeilly
patent: 5267607 (1993-12-01), Wada
patent: 5286296 (1994-02-01), Sato et al.
patent: 5303671 (1994-04-01), Kondo et al.
patent: 5314541 (1994-05-01), Saito et al.
patent: 5436202 (1995-07-01), Miura
patent: 5439780 (1995-08-01), Joshi et al.
patent: 5489339 (1996-02-01), Hattori et al.
patent: 5524131 (1996-06-01), Uzawa et al.
patent: 5611655 (1997-03-01), Fukasawa et al.
patent: 5618350 (1997-04-01), Ishikawa et al.
patent: 5761064 (1998-06-01), La et al.
patent: 5822389 (1998-10-01), Uzawa et al.
patent: 5837059 (1998-11-01), Glants
patent: 5906680 (1999-05-01), Meyerson
patent: 5914493 (1999-06-01), Morita et al.
patent: 5925227 (1999-07-01), Kobayashi et al.
patent: 5943230 (1999-08-01), Rinnen et al.
patent: 5980591 (1999-11-01), Akimoto et al.
patent: 6086952 (2000-07-01), Lang et al.
patent: 6110232 (2000-08-01), Chen et al.
patent: 6211081 (2001-04-01), Mikata
patent: 6224312 (2001-05-01), Sundar
patent: 6275744 (2001-08-01), Yoshida
patent: 6319322 (2001-11-01), Ueda et al.
patent: 6321134 (2001-11-01), Henley et al.
patent: 6328864 (2001-12-01), Ishizawa et al.
patent: 6409932 (2002-06-01), Wang et al.
patent: 6448537 (2002-09-01), Nering
patent: 6457866 (2002-10-01), Scheibl
patent: 6468384 (2002-10-01), Singh et al.
patent: 6508062 (2003-01-01), Flanigan
patent: 6605226 (2003-08-01), Wang et al.
patent: 6663333 (2003-12-01), Kinnard et al.
patent: 6672864 (2004-01-01), Wang et al.
patent: 6707533 (2004-03-01), Mishima
patent: 6736927 (2004-05-01), Wang et al.
patent: 6828235 (2004-12-01), Takano
patent: 2002/0011207 (2002-01-01), Uzawa et al.
patent: 0 863 439 (1998-02-01), None
patent: 4-277025 (1992-10-01), None
patent: 5-152425 (1993-06-01), None
patent: 7-142408 (1995-06-01), None
patent: 07-142408 (1995-06-01), None
patent: 10-50789 (1998-02-01), None
patent: 10-284389 (1998-10-01), None
patent: 2000-58455 (2000-02-01), None
patent: 2001-118904 (2001-04-01), None
patent: 2002-57100 (2002-02-01), None
patent: WO 99/22403 (1999-05-01), None
patent: WO 99/31714 (1999-06-01), None
European Search Report dated Feb. 10, 2004, issued in corresponding European patent appln. No. 02 25 5150, forwarded in a Communication dated Feb. 17, 2004.
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Von Buhr Maria N.
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