Molded wafer scale cap array

Details Molded wafer scale cap array Molded wafer scale cap array

2006-01-03

2006-01-03

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S113000, C438S460000

Reexamination Certificate

active

06982189

ABSTRACT:
An array of caps is taught for protecting features on a semiconductor wafer. The array is fabricated by a novel method in which a two part mold is used. The array is made from a layer of thermoplastic material which is placed in the mold. Each cap in the array has a central portion and a perimeter wall. The mold is opened so that the array is carried by the first half. The array is applied to a wafer using the first half. After the arrays are applied, the wafer is separated into individual chips.

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