Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material
Reexamination Certificate
2006-07-11
2006-07-11
Tran, Mai-Huong (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Organic semiconductor material
C250S370080, C250S370010, C250S370060, C250S370090, C250S370110
Reexamination Certificate
active
07075104
ABSTRACT:
A novel method of manufactring a microchannel plate (“MCP”) is disclosed. The method comprises the steps of ion implantation of a substrate, the subsequent formation of channels paterned on the surface of the substrate and bonding of the subsequent substrate to a handle wafer. The layers are subsequently cleaved and the steps repeated until a MCP structure is achieved. The resulting MCP structure is cost-effective as compared to conventional manufacturing processes and the resulting MCP structure exhibits a funneling effect. The MCP structure may also be used for optical signal amplification for a biochip array.
REFERENCES:
patent: 6362482 (2002-03-01), Stettner et al.
Reveo Inc.
Tran Mai-Huong
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