Method of cleaning damascene structure of semiconductor...

Semiconductor device manufacturing: process – Chemical etching

Reexamination Certificate

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C156S345120

Reexamination Certificate

active

06992007

ABSTRACT:
A method of cleaning a damascene structure of a semiconductor wafer comprises a process of treating the wafer, which has been polished, using pure water; and subsequently a process of treating the wafer without using pure water.

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patent: 2002-97584 (2002-04-01), None
patent: WO 01/99168 (2001-12-01), None

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