Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate
2006-01-31
2006-01-31
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Chemical etching
C156S345120
Reexamination Certificate
active
06992007
ABSTRACT:
A method of cleaning a damascene structure of a semiconductor wafer comprises a process of treating the wafer, which has been polished, using pure water; and subsequently a process of treating the wafer without using pure water.
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Le Thao P.
NEC Electronics Corporation
Nelms David
Young & Thompson
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