Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2006-04-04
2006-04-04
Ngo, Hung V. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S260000, C174S262000, C257S691000, C257S738000
Reexamination Certificate
active
07022913
ABSTRACT:
An electronic component includes a substrate; a functional part that is formed beneath at least one of a front face and a bottom face of the substrate and that performs a predetermined function; a plurality of terminals that is formed on the front face or the bottom face of the substrate and that is connected to the functional part; a plurality of outer electrodes formed on the front face and the bottom face of the substrate; and interconnection lines, formed on the front face and the bottom face of the substrate, for connecting the terminals on the front face or the bottom face of the substrate to the outer electrodes.
REFERENCES:
patent: 5541450 (1996-07-01), Jones et al.
patent: 6218731 (2001-04-01), Huang et al.
patent: 6452807 (2002-09-01), Barrett
patent: 6727116 (2004-04-01), Poo et al.
patent: 2001/0017411 (2001-08-01), Terui
patent: 2004/0089936 (2004-05-01), Shizuno
patent: 11-087402 (1999-03-01), None
patent: 2002-050738 (2002-02-01), None
patent: 2002-170904 (2002-06-01), None
Harness & Dickey & Pierce P.L.C.
Ngo Hung V.
Seiko Epson Corporation
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