Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2006-04-11
2006-04-11
Edmondson, Lynne R. (Department: 1725)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S388000, C219S390000, C219S391000, C219S412000, C228S233200
Reexamination Certificate
active
07026582
ABSTRACT:
A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.
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English Abstract of German Patent No. 101 45 883 C1.
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Goenka Lakhi N.
Moss Sherwin T.
Schmidt Larry N.
Sinkunas Peter J.
Brinks Hofer Gilson & Lione
Edmondson Lynne R.
Visteon Global Technologies Inc.
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