Method for producing an integrated circuit with a rewiring...

Details Method for producing an integrated circuit with a rewiring... Method for producing an integrated circuit with a rewiring...

2006-07-11

2006-07-11

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S125000, C257S701000

Reexamination Certificate

active

07074649

ABSTRACT:
The present invention provides a method for producing an integrated circuit with a rewiring device. In the method, there is provision of a carrier device with defined cutouts, application of at least one integrated circuit upside down to the carrier device such that the defined cutouts of the carrier device are located above at least one connection device of the integrated circuit application of an insulation device to that side of the carrier device which is not covered by the integrated circuit, omitting the at least one connection device in the cutout); application of the patterned rewiring device to the insulation device; application of a patterned solder resist device to the patterned rewiring device; and patterned application of solder balls on sections of the rewiring device which are not covered by the patterned solder resist device. The present invention likewise provides such an apparatus.

REFERENCES:
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6573598 (2003-06-01), Ohuchi et al.
patent: 197 02 014 (1998-04-01), None
patent: 199 60 249 (2001-07-01), None
patent: 101 38 042 (2002-11-01), None
patent: 2001332653 (2001-11-01), None

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