Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-07-11
2006-07-11
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S455000
Reexamination Certificate
active
07074644
ABSTRACT:
The present invention provides an electronic circuit in which functional elements are formed on a first substrate, wiring lines are formed on a second substrate, element chips including at least one functional element are peeled from the first substrate and transferred onto the second substrate, and the second substrate is curved, a thin film transistor circuit substrate in which a thin film transistor is used as the functional element in the electronic circuit, and an active matrix display device in which the thin film transistor is used as an active matrix device in the thin film transistor circuit substrate. In cases where it is desirable to obtain a flexible electronic circuit substrate, a flexible thin film transistor circuit substrate, or a flexible active matrix display device by forming the second substrate or the wiring lines to be curved, the element chip is not peeled from the second substrate and is not split. The element chips are rectangular, and the short sides of the element chips are arranged along the curving direction of the second substrate.
REFERENCES:
patent: 5981036 (1999-11-01), Schulz-Harder et al.
patent: 6261881 (2001-07-01), Yamazaki et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6521511 (2003-02-01), Inoue et al.
patent: 2003/0047732 (2003-03-01), Yamazaki et al.
patent: A 11-39440 (1999-02-01), None
patent: A 11-282995 (1999-10-01), None
patent: A 2001-282423 (2001-10-01), None
patent: A 2001-282424 (2001-10-01), None
patent: A 2002-311858 (2002-10-01), None
patent: A 2002-314052 (2002-10-01), None
patent: A 2002-314123 (2002-10-01), None
patent: A 2002-343944 (2002-11-01), None
patent: A 2002-368282 (2002-12-01), None
patent: A 2003-77940 (2003-03-01), None
patent: A 2003-133708 (2003-05-01), None
patent: A 2003-258210 (2003-09-01), None
patent: 360901 (1999-06-01), None
patent: 382820 (2000-02-01), None
S. Utsunomiya et al., Low Temperature Poly-SI TFT-LCD Transferred onto Plastic Substrate Using Surface Free Technology by Laser Ablation/Annealing (SUFTLA®), Asia Display/IDW '01, pp. 339-342.
Dang Phuc T.
Oliff & Berridg,e PLC
Seiko Epson Corporation
LandOfFree
Method of manufacturing thin film element, thin film... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing thin film element, thin film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing thin film element, thin film... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3578823