Wafer polishing apparatus with retainer ring

Details Wafer polishing apparatus with retainer ring Wafer polishing apparatus with retainer ring

1998-05-27

2000-03-07

Scherbel, David A.

Abrading

Machine

Rotary tool

451287, B24B 500

Patent

active

060332921

ABSTRACT:
A rubber sheet is arranged between a head body and a retainer ring of a wafer holding head. Two O-rings air-tightly close a space between the periphery of the rubber sheet, which is located above the retainer ring, and the head body. When a pump supplies the compressed air to the space, the periphery of the rubber sheet is elastically deformed to press the retainer ring under uniform pressure.

REFERENCES:
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5538465 (1996-07-01), Netsu et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5588902 (1996-12-01), Tominaga et al.
Patent Abstracts of Japan, vol. 14, No. 570 (M-1060), Dec. 18, 1990, JP 2-243263 A (Hitachi Ltd.), Abstract.
Database WPIL on Questel, Week 9502, London: Derwent Publications Ltd., AN 95-010404, Class F26B, JP 06-295893 A (Mitsubishi Material Silicon KK and Mitsubishi Materials Corp), Abstract.

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