Lead frame decoupling capacitor, semiconductor device...

Details Lead frame decoupling capacitor, semiconductor device... Lead frame decoupling capacitor, semiconductor device...

2006-07-04

2006-07-04

Wille, Douglas A. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S728000

Reexamination Certificate

active

07071542

ABSTRACT:
A lead frame includes at least two layers, each of which includes an electrically conductive bus and a group of leads that extend substantially unidirectionally from a single edge of the lead frame. The lead fingers of each layer may extend in substantially the same direction. The electrically conductive buses of the two or more lead frame layers are at least partially superimposed with respect to one another. An insulator element is disposed between at least portions of the superimposed regions of the buses. One of the buses is connectable to a power supply source (VCC), while the other is connectable to a power supply ground (VSS). Thus, the mutually superimposed regions of the buses form a decoupling capacitor. Lead fingers of one of the layers may be arranged in groups which flank the remainder of the lead fingers so that they are not interleaved therewith.

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