Saw device

Details Saw device Saw device

2006-01-10

2006-01-10

Schuberg, Darren (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S31300R, C310S31300R

Reexamination Certificate

active

06984918

ABSTRACT:
The present invention provides a surface acoustic wave device comprising a diamond, having operating frequencies in the range of several hundreds of MHz to several tens of GHz, and being capable of operating at high frequencies.The surface acoustic wave device of the present invention comprises a diamond layer or a substrate layer and a diamond layer, a ZnO piezoelectric layer, interdigital transducers and a short-circuit electrode layer, being characterized in that (2π·H/λM) is in the range of 3.0 to 10.0 where the thickness of the ZnO layer is H and the wavelength of the surface acoustic wave is λM.

REFERENCES:
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patent: 5446329 (1995-08-01), Nakahata et al.
patent: 5581141 (1996-12-01), Yamada et al.
patent: 5838090 (1998-11-01), Nakahata et al.
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Yamanouchi, et al “Saw Propagation Characteristics and Fabrication Technology of Piezoelectric Thin Film/Diamond Structure” 1989, IEEE, UltraSonics Symposium, vol. 1, pp. 351-354.
Shikata, et al “1.5GHz Saw Bandpass Filter Using Poly-Crystalline Diamond” 1993, UltraSonics Symposium, pp. 277-280.
Nakahata, et al “High Frequency Surface Acoustic Wave Filter Using ZnO/Diamond/Si Structure” 1992, UltraSonics Symposium, pp. 377-380.
Nakahata, et al “Saw Devices on Diamond” 1995, IEEE UltraSonics Symposium, pp. 361-370.
Nakahata, et al “High Frequency Surface Acoustic Wave Filter Using ZnO/Diamond/SI Structure” Reprinted from Jpn. J. Appl. Phys. vol. 33, Part 1, No. 1A, Jan. 1994.

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