Method of making circuitized substrate assembly

Details Method of making circuitized substrate assembly Method of making circuitized substrate assembly

2006-05-23

2006-05-23

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S844000, C029S846000, C029S852000, C029S853000, C174S264000, C361S795000

Reexamination Certificate

active

07047630

ABSTRACT:
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

REFERENCES:
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patent: 6826830 (2004-12-01), Egitto et al.
IBM TDB, “Automatic Method For Registration And Stacking of Laminates”, by Hollis.
IBM TDB, “Multilayer Subsurface Circuit Board Constructions”, by Mace.

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