Inkjet printhead with deep reverse etch in integrated...

Incremental printing of symbolic information – Ink jet – Ejector mechanism

Reexamination Certificate

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C347S062000

Reexamination Certificate

active

07018021

ABSTRACT:
An inkjet printhead with nozzles (3), chambers (7) and heater elements (10) formed on an ejection side of a silicon wafer substrate (8) using lithographically masked etching and deposition techniques, and conduits (9) are etched into the reverse side of the silicon wafer (8) opposite the ejection side, the conduits (9) being configured for feeding bubble forming liquid (11) to the bubble forming chambers (7), wherein,the conduits (7) are etched to a depth greater than 100 microns from the reverse side of the wafer (8).Etching the wafer from both sides eliminates ink feed conduits on the ejections side of the wafer. This allows nozzle density to increase. By making the reverse etch deep (greater than 100 microns), the viscous drag will provide enough resistance to substantially prevent reverse ink flow from the bubble in the chamber.

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