Polishing apparatus and method

Details Polishing apparatus and method Polishing apparatus and method

2006-09-19

2006-09-19

Morgan, Eileen P. (Department: 3723)

Abrading

Machine

Combined

C451S287000, C451S246000, C451S254000, C451S446000

Reexamination Certificate

active

07108589

ABSTRACT:
A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

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