Stacked type semiconductor device

Details Stacked type semiconductor device Stacked type semiconductor device

2006-01-31

2006-01-31

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

06991964

ABSTRACT:
Disclosed is a stacked type semiconductor device having a plurality of semiconductor integrated circuit chips stacked, each of the semiconductor integrated circuit chips comprising a holding circuit holding identification information about the chip, electrically written in the chip, an identification information setting circuit setting the identification information about the chip, in the holding circuit after the plurality of semiconductor integrated circuit chips have been stacked, and at least one setting terminal used to set the identification information about the chip, in the holding circuit, wherein the at least one setting terminal of any semiconductor integrated circuit chip is connected to the at least one corresponding setting terminal of any other semiconductor integrated circuit chip.

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