Process for manufacturing a printed wiring board

Details Process for manufacturing a printed wiring board Process for manufacturing a printed wiring board

2006-03-07

2006-03-07

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S846000, C205S118000, C228S179100, C228S180210

Reexamination Certificate

active

07007378

ABSTRACT:
A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold application in the outer surface of the connector. Physical hardness and durability are derived from a thin palladium layer lying beneath the flash gold layer.

REFERENCES:
patent: 5066550 (1991-11-01), Horibe et al.
patent: 5356526 (1994-10-01), Franenthal et al.
patent: 5549808 (1996-08-01), Farooq et al.
patent: 6083375 (2000-07-01), Cheng et al.
patent: 6669077 (2003-12-01), Kawashima et al.
patent: 6809414 (2004-10-01), Lin et al.

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