Semiconductor devices and manufacturing method therefor and...

Details Semiconductor devices and manufacturing method therefor and... Semiconductor devices and manufacturing method therefor and...

2006-05-02

2006-05-02

Fureman, Jared J. (Department: 2876)

Registers

Records

Conductive

C340S572700, C343S7000MS

Reexamination Certificate

active

07036741

ABSTRACT:
In a wireless IC tag utilizing a wireless IC chip, the wireless IC tag having sufficient stress strength is manufactured economically. There is adopted a structure in which an upper electrode and a lower electrode are respectively formed on a front surface and a rear surface of a wireless IC chip, and the upper electrode is connected to a first conductor and a lower electrode is connected to a second conductor, and the first conductor and the second conductor are connected outside the wireless IC chip. Thereby, it is possible to fabricate the wireless IC tag economically and to ensure the stress strength.

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