Method of manufacturing a semiconductor element-mounting board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S831000, C029S841000, C029S847000, C174S255000, C264S328120, C361S748000

Reexamination Certificate

active

07036221

ABSTRACT:
A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

REFERENCES:
patent: 3862790 (1975-01-01), Davies et al.
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4616406 (1986-10-01), Brown
patent: 4778950 (1988-10-01), Lee et al.
patent: 4916523 (1990-04-01), Sokolovsky
patent: 4926241 (1990-05-01), Carey
patent: 5036431 (1991-07-01), Adachi et al.
patent: 5165651 (1992-11-01), Welch et al.
patent: 5258648 (1993-11-01), Lin
patent: 5281771 (1994-01-01), Swift et al.
patent: 5364276 (1994-11-01), Inasaka
patent: 5410807 (1995-05-01), Bross et al.
patent: 5455456 (1995-10-01), Newman
patent: 5477933 (1995-12-01), Nguyen
patent: 5478972 (1995-12-01), Mizutani et al.
patent: 5483421 (1996-01-01), Gedney et al.
patent: 5517751 (1996-05-01), Bross et al.
patent: 5535101 (1996-07-01), Miles et al.
patent: 5541567 (1996-07-01), Fogel et al.
patent: 5637176 (1997-06-01), Gilleo et al.
patent: 5781264 (1998-07-01), Noda et al.
patent: 5810607 (1998-09-01), Shih et al.
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 587 442 (1994-03-01), None
patent: 602 328 (1994-06-01), None
patent: 603 928 (1994-06-01), None
patent: 361237458 (1986-10-01), None
patent: 02-11375 (1990-01-01), None
patent: 04-240759 (1992-08-01), None
patent: 08-167630 (1996-06-01), None

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