Write head design with improved bump to control write...

Details Write head design with improved bump to control write... Write head design with improved bump to control write...

2006-09-19

2006-09-19

Cao, Allen (Department: 2627)

Dynamic magnetic information storage or retrieval

Head

Core

Reexamination Certificate

active

07110217

ABSTRACT:
A magnetic head having an air bearing surface (ABS) and a first pole tip. A second pole tip is spaced apart from and facing the upper end of the first pole tip across a write gap. A bump extends into a portion of the upper end of the first pole tip and a portion of the bottom end of the second pole tip, the bump being positioned away from the ABS. The bump defines a throat height of the first and second pole tips.

REFERENCES:
patent: 5751522 (1998-05-01), Yamada et al.
patent: 6029339 (2000-02-01), Chang et al.
patent: 6185081 (2001-02-01), Simion et al.
patent: 6301076 (2001-10-01), Stageberg et al.
patent: 6404601 (2002-06-01), Rottmayer et al.
patent: 6542331 (2003-04-01), Chang et al.
patent: 6683750 (2004-01-01), Sato
patent: 6751055 (2004-06-01), Alfoqaha et al.
patent: 6765757 (2004-07-01), Kawasaki et al.
patent: 2002/0015266 (2002-02-01), Han et al.
patent: 2002/0026705 (2002-03-01), Santini
patent: 2002/0131205 (2002-09-01), Gotoh et al.
patent: 2003/0048582 (2003-03-01), Kanada et al.
patent: 2003/0072104 (2003-04-01), Sato et al.
patent: 2003/0147176 (2003-08-01), Gotoh et al.
patent: 2004/0070876 (2004-04-01), Yazawa
patent: 2004/0095676 (2004-05-01), Sato et al.

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