Circuit cooling apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S046000, C165S080400, C165S104330, C174S015200, C257S715000, C257S722000, C361S703000

Reexamination Certificate

active

07019973

ABSTRACT:
Representative embodiments provide for a circuit device cooling apparatus having a first heat pipe which includes a first heat pipe condenser, and a second heat pipe which includes a second heat pipe condenser. A heat sink is attached to the first heat pipe condenser and the second heat pipe condenser. Another representative embodiment provides for a method of removing heat from a first circuit device and a second circuit device. The method includes providing a heat dissipating member, and connecting the first circuit device to the heat dissipating member with a first heat pipe. the method further includes connecting the second circuit device to the heat dissipating member with a second heat pipe, and providing compliance between the first heat pipe and the second heat pipe.

REFERENCES:
patent: 5168348 (1992-12-01), Chu et al.
patent: 5661637 (1997-08-01), Villaume
patent: 5829512 (1998-11-01), August
patent: 5982616 (1999-11-01), Moore
patent: 6189601 (2001-02-01), Goodman et al.
patent: 6504720 (2003-01-01), Furuya
patent: 6595270 (2003-07-01), Machiroutu et al.
patent: 0348 838 (1990-01-01), None
patent: 1 526 160 (1978-09-01), None
patent: 58083183 (1983-05-01), None
patent: 9329394 (1997-12-01), None

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