Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-03-28
2006-03-28
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S046000, C165S080400, C165S104330, C174S015200, C257S715000, C257S722000, C361S703000
Reexamination Certificate
active
07019973
ABSTRACT:
Representative embodiments provide for a circuit device cooling apparatus having a first heat pipe which includes a first heat pipe condenser, and a second heat pipe which includes a second heat pipe condenser. A heat sink is attached to the first heat pipe condenser and the second heat pipe condenser. Another representative embodiment provides for a method of removing heat from a first circuit device and a second circuit device. The method includes providing a heat dissipating member, and connecting the first circuit device to the heat dissipating member with a first heat pipe. the method further includes connecting the second circuit device to the heat dissipating member with a second heat pipe, and providing compliance between the first heat pipe and the second heat pipe.
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Hewlett--Packard Development Company, L.P.
Thompson Gregory
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