Semiconductor chip package

Details Semiconductor chip package Semiconductor chip package

2006-07-11

2006-07-11

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S778000, C257S782000, C257S783000, C257S666000, C257S723000, C257S724000, C257S780000

Reexamination Certificate

active

07075177

ABSTRACT:
A semiconductor chip package is formed by a first semiconductor chip and a second semiconductor chip, which have electrodes for wiring at surfaces thereof, being integrated and mounted in a state in which reverse surfaces thereof oppose one another. Therefore, two semiconductor chips can be freely combined and mounted regardless of chip sizes thereof, and lengths of wires can be shortened. Thus, a wire-bonding yield can be improved, and a semiconductor package having excellent electric characteristics can be obtained.

REFERENCES:
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 6077724 (2000-06-01), Chen
patent: 6118176 (2000-09-01), Tao et al.
patent: 6118184 (2000-09-01), Ishio et al.
patent: 6133067 (2000-10-01), Jeng et al.
patent: 6201302 (2001-03-01), Tzu
patent: 6268648 (2001-07-01), Fukutomi et al.
patent: 6297547 (2001-10-01), Akram
patent: 6414381 (2002-07-01), Takeda
patent: 6459039 (2002-10-01), Bezama et al.
patent: 2002/0030261 (2002-03-01), Rolda et al.
patent: 2001036630 (1999-10-01), None
patent: 2002042958 (2000-12-01), None

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