Methods for shielding one or more circuit of a printed...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S832000, C029S846000, C029S847000, C174S034000, C228S248100, C361S816000

Reexamination Certificate

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06990734

ABSTRACT:
Methods for forming a metal shield on a printed circuit board (10) include depositing a first layer of metal (41) on a substrate (22) of the printed circuit board (10), depositing a first layer of dielectric material (42) on the first layer of metal (41), printing one or more circuits (21, 21′) on the first dielectric layer (42), depositing a second layer of dielectric material (43) over the one or more printed circuits (21, 21′), forming a trench-like opening (44) in the two layers of dielectric material (42, 43) surrounding the one or more printed circuits (21, 21′) so that the metal of the first layer (41) is exposed by the trench-like opening (44), depositing a second layer of metal (27) on the second layer of dielectric material (43) such that the second layer of metal (27) plates the trench-like opening (44) and makes electrical contact with the first metal layer (41).

REFERENCES:
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patent: 5375322 (1994-12-01), Leeb
patent: 5677515 (1997-10-01), Selk et al.
patent: 5886876 (1999-03-01), Yamaguchi
patent: 5981869 (1999-11-01), Kroger
patent: 6000120 (1999-12-01), Arledge et al.
patent: 6020219 (2000-02-01), Dudderar et al.
patent: 6110563 (2000-08-01), Pienimaa et al.
patent: 6388205 (2002-05-01), Chua
patent: 6485595 (2002-11-01), Yenni et al.
patent: 6625040 (2003-09-01), Tuttle

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