Photocopying – Projection printing and copying cameras – Step and repeat
Patent
1994-07-13
1996-06-11
Braun, Fred L.
Photocopying
Projection printing and copying cameras
Step and repeat
355 68, 355 69, G03B 2742, H01L 2102
Patent
active
055260934
ABSTRACT:
An exposure apparatus including a scanner for scanning a substrate to be exposed with an exposure beam; and an exposure amount controller for controlling an amount of exposure by the exposure beam in accordance with a position on the substrate. An exposure apparatus including a scanner for scanning a substrate to be exposed with an exposure beam; a detector for detecting a distribution of a film thickness of a radiation sensitive layer on the substrate; and an exposure amount changing controller for controlling an amount of exposure by the exposure beam in accordance with the film thickness distribution.
REFERENCES:
patent: 4422083 (1983-12-01), Neumann et al.
patent: 4750161 (1988-06-01), Takeuchi et al.
Buckley, et al., "Step and Scan: A Systems Overview of a New Lithography Tool," SPIE; Optical/Laser Microlithography II, vol. 1088, 1989, pp. 424 through 433.
Braun Fred L.
Canon Kabushiki Kaisha
LandOfFree
Exposure apparatus and method for a semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Exposure apparatus and method for a semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Exposure apparatus and method for a semiconductor wafer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-356534