Stand-alone organic-based passive devices

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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C257S528000, C257S531000, C257S660000, C257S759000, C257S700000

Reexamination Certificate

active

06987307

ABSTRACT:
The present invention provides for low cost discrete inductor devices in an all organic platform. The inductor devices can utilize virtually any organic material that provides the desired properties, such as liquid crystalline polymer (LCP) or polyphenyl ether (PPE), in a multilayer structure, wherein the organic materials have low moisture uptake and good temperature stability. Each layer may be metalized and selectively interconnected by vias formed in respective layers so as to form winding or coiled inductors. The inductor devices may advantageously include external shielding formed by metalizing the side walls and top surface of the inductor devices on in-built shielding achieved by the utilization of the hybrid co-planar waveguide topologies. The inductor devices can be configured for either ball grid array (BGA)/chip scale package (CSP) or surface mount device (SMD) mounting to circuit boards.

REFERENCES:
patent: 5106461 (1992-04-01), Volfson et al.
patent: 5162257 (1992-11-01), Yung
patent: 5247377 (1993-09-01), Omeis et al.
patent: 5270493 (1993-12-01), Inoue et al.
patent: 5323128 (1994-06-01), Ishizaki et al.
patent: 5349314 (1994-09-01), Shimizu et al.
patent: 5373271 (1994-12-01), Hirai et al.
patent: 5384434 (1995-01-01), Mandai et al.
patent: 5396201 (1995-03-01), Ishizaki et al.
patent: 5416454 (1995-05-01), McVeety
patent: 5497337 (1996-03-01), Ponnapalli et al.
patent: 5517751 (1996-05-01), Bross et al.
patent: 5521564 (1996-05-01), Kaneko et al.
patent: 5532667 (1996-07-01), Haertling et al.
patent: 5545916 (1996-08-01), Koullias
patent: 5559360 (1996-09-01), Chiu et al.
patent: 5610433 (1997-03-01), Merrill et al.
patent: 5635892 (1997-06-01), Ashby et al.
patent: 5654681 (1997-08-01), Ishizaki et al.
patent: 5668511 (1997-09-01), Furutani et al.
patent: 5679414 (1997-10-01), Akashi et al.
patent: 5703544 (1997-12-01), Hays, III
patent: 5716663 (1998-02-01), Capote et al.
patent: 5719354 (1998-02-01), Jester et al.
patent: 5719539 (1998-02-01), Ishizaki et al.
patent: 5720898 (1998-02-01), Nohira et al.
patent: 5739193 (1998-04-01), Walpita et al.
patent: 5770986 (1998-06-01), Tonegawa et al.
patent: 5801100 (1998-09-01), Lee et al.
patent: 5818313 (1998-10-01), Estes et al.
patent: 5844299 (1998-12-01), Merrill et al.
patent: 5917244 (1999-06-01), Lee et al.
patent: 5955931 (1999-09-01), Kaneko et al.
patent: 5999243 (1999-12-01), Kameyama et al.
patent: 6005197 (1999-12-01), Kola et al.
patent: 6008102 (1999-12-01), Alford et al.
patent: 6021050 (2000-02-01), Ehman et al.
patent: 6026286 (2000-02-01), Long
patent: 6031727 (2000-02-01), Duesman et al.
patent: 6040226 (2000-03-01), Wojnarowski et al.
patent: 6051289 (2000-04-01), Tsujimoto et al.
patent: 6093599 (2000-07-01), Lee et al.
patent: 6114925 (2000-09-01), Lo
patent: 6127905 (2000-10-01), Horie
patent: 6153290 (2000-11-01), Sunahara
patent: 6166799 (2000-12-01), Kameyama et al.
patent: 6171716 (2001-01-01), Sasaki et al.
patent: 6177853 (2001-01-01), Nagatomi et al.
patent: 6191666 (2001-02-01), Sheen
patent: 6191669 (2001-02-01), Shigemura
patent: 6225696 (2001-05-01), Hathaway et al.
patent: 6249962 (2001-06-01), Bergstedt
patent: 6255714 (2001-07-01), Kossives et al.
patent: 6259037 (2001-07-01), Feilchenfeld et al.
patent: 6259148 (2001-07-01), Bartush et al.
patent: 6261872 (2001-07-01), Hathaway et al.
patent: 6281430 (2001-08-01), Lupo et al.
patent: 6287931 (2001-09-01), Chen
patent: 6303423 (2001-10-01), Lin
patent: 6380608 (2002-04-01), Bentley
patent: 6395374 (2002-05-01), McAndrew et al.
patent: 6421225 (2002-07-01), Bergstedt
patent: 6445266 (2002-09-01), Nagatomi et al.
patent: 6492886 (2002-12-01), Kushitani et al.
patent: 6528732 (2003-03-01), Okubora et al.
patent: 6583687 (2003-06-01), Nosaka
patent: 6625037 (2003-09-01), Nakatani et al.
patent: 6713162 (2004-03-01), Takaya et al.
patent: 2001/0004228 (2001-06-01), Hirai et al.
patent: 2001/0016980 (2001-08-01), Bergstedt
patent: 2001/0050599 (2001-12-01), Maekawa et al.
patent: 2002/0008301 (2002-01-01), Liou et al.
patent: 2002/0048930 (2002-04-01), Lin
patent: 2002/0064701 (2002-05-01), Hand et al.
patent: 2002/0064922 (2002-05-01), Lin
patent: 2002/0074158 (2002-06-01), St. Lawrence et al.
patent: 2002/0076538 (2002-06-01), St. Lawrence et al.
patent: 2002/0081443 (2002-06-01), Connelly et al.
patent: 2002/0158305 (2002-10-01), Dalmia et al.
patent: 2002/0172021 (2002-11-01), Seri et al.
patent: 2002/0195270 (2002-12-01), Okubora et al.
patent: 2004/0034489 (2004-02-01), Ogino et al.
patent: 0 645 952 (1995-03-01), None
patent: 0506476 (1996-05-01), None
patent: 0510971 (1997-03-01), None
patent: 1 235 235 (2002-08-01), None
patent: 1 411 553 (2004-04-01), None
patent: 09 130103 (1995-10-01), None
patent: WO01/97582 (2001-12-01), None
patent: WO 01/95679 (2001-12-01), None
www.stneasy.org.tmp; Display from INSPEC; Taoka, M., Kanetaka, T., Dec. 4, 2002.
Alvin L.S. Loke, et al., “Evaluation of Copper Penetration in Low-κ Polymer Dielectrics by Bias-Temperature Stress,” MRS Spring Meeting, Symposium N/O, Paper O4.4, San Francisco, CA, Apr. 7, 1999.
Wang, et al., “A Full-Wave Analysis Model for Uniplananr Circuits with Lumped Elements,” IEEE Transactions on Microwave Theory and Techniques, vol. 51, No. 1, Jan. 2003.
www.sbir.gsfc.nasa.gov/SBIR/successes/ss/110text.html; Liquid Crystal Polymers for Printed Wiring Boards.
www.yamaichi.us/yflex.html; Flexible Printed Circuit—YFLEX.
Hong, J.S. et al., “Filters for RF/Microwave Applications,” Wiley-Interscience Publication, 2001, pp. 121-159.
Son, M.H. et al., Low-Cost Realization of ISM Band Pass Filters Using Integrated Combline Structures, 2000, (4 pages).
Matijasevic, G. et al., “MCM-L Substrates Fabricated Using Patterned TLPS Conductive Composites,” 1997 International Conference on Multichip Modules, Apr. 2, 1997, pp. 64-69.
Charles, H.K., “Packaging With Multichip Modules,” 1992 IEEE/CHMT Int'l Electronics Manufacturing Technology Symposium, pp. 206-210.
Min, S.H. et al., “Design, Fabrication, Measurement and Modeling of Embedded Inductors in Laminate Technology,” ASME International Electronic Packaging Technical Conference and Exhibition, Jul. 8-13, 2001, pp. 1-5.
Dalmia, S. et al., “Modeling RF Passive Circuits Using Coupled Lines and Scalable Models,” 2001 Electronic Components and Technology Conference, pp. 816-823.
Patent Abstracts of Japan vol. 1995, No. 09, Oct. 21, 1995.

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