Arrangement with a semiconductor chip and support therefore...

Details Arrangement with a semiconductor chip and support therefore... Arrangement with a semiconductor chip and support therefore...

2006-05-30

2006-05-30

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S734000

Reexamination Certificate

active

07053489

ABSTRACT:
The invention relates to an assembly comprising a support, which bears a semiconductor chip that is connected to a metallized surface on the rear of the support by means of a through-plating. A first nail head contact, from which the connection wire has been separated, is formed on the through-plating. A second nail head contact is formed on a connection pad of the semiconductor chip. The wire that connects the semiconductor to the through-plating runs from said second nail head contact to the first nail head contact and is connected to the latter by means of a wedge contact.

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PCT International Search Report Application No. PCT/DE03/02465, 3 pages (English), Mailed Nov. 10, 2003.

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