Semiconductor package using terminals formed on a conductive...

Details Semiconductor package using terminals formed on a conductive... Semiconductor package using terminals formed on a conductive...

2006-05-30

2006-05-30

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S687000

Reexamination Certificate

active

07053483

ABSTRACT:
A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.

REFERENCES:
patent: 4054938 (1977-10-01), Morris, Sr.
patent: 4222516 (1980-09-01), Badet et al.
patent: 4264917 (1981-04-01), Ugon
patent: 4463971 (1984-08-01), Hoppe et al.
patent: 4532419 (1985-07-01), Takeda
patent: 4649418 (1987-03-01), Uden
patent: 4754319 (1988-06-01), Saito et al.
patent: 4766480 (1988-08-01), Hamada
patent: 4872825 (1989-10-01), Ross
patent: 4931853 (1990-06-01), Ohuchi et al.
patent: 4961053 (1990-10-01), Krug
patent: 4990759 (1991-02-01), Gloton et al.
patent: 4994659 (1991-02-01), Yabe et al.
patent: 5036430 (1991-07-01), Hills
patent: 5144747 (1992-09-01), Eichelberger
patent: 5272374 (1993-12-01), Kodai et al.
patent: 5307240 (1994-04-01), McMahon
patent: 5315241 (1994-05-01), Ewers
patent: 5375037 (1994-12-01), Le Roux
patent: 5493151 (1996-02-01), Asada et al.
patent: D368082 (1996-03-01), Goto
patent: 5550709 (1996-08-01), Iwasaki
patent: 5581065 (1996-12-01), Nishikawa et al.
patent: 5612532 (1997-03-01), Iwasaki
patent: 5663901 (1997-09-01), Wallace et al.
patent: 5677524 (1997-10-01), Haghiri-Tehrani
patent: 5752857 (1998-05-01), Knights
patent: 5757116 (1998-05-01), Nishikawa et al.
patent: 5770877 (1998-06-01), Park
patent: 5783857 (1998-07-01), Ziegner et al.
patent: 5796164 (1998-08-01), McGraw et al.
patent: 5822190 (1998-10-01), Iwasaki
patent: 5874319 (1999-02-01), Dunaway et al.
patent: 5906516 (1999-05-01), Sato et al.
patent: 5933713 (1999-08-01), Farnworth
patent: 6002178 (1999-12-01), Lin
patent: 6104095 (2000-08-01), Shin et al.
patent: 6109939 (2000-08-01), Kondo et al.
patent: 6137710 (2000-10-01), Iwasaki et al.
patent: 6180881 (2001-01-01), Isaak
patent: 6199756 (2001-03-01), Kondo et al.
patent: 535436 (1992-09-01), None
patent: 61-15289 (1984-06-01), None
“Smart Card Standards”, smart Card Industry Association, www.scia.org/aboutSmartcards, ISO 7816 Parts 1-3, pp. 1-23 (Jan. 10, 2000).

Affiliated with

Also associated with

Rating

Semiconductor package using terminals formed on a conductive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package using terminals formed on a conductive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package using terminals formed on a conductive... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3563537