Method of making chip resistor

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S603180, C029S620000, C029S621000, C029S831000, C029S832000, C029S835000, C338S309000

Reexamination Certificate

active

07103965

ABSTRACT:
The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the first direction. The method includes an upper electrode forming step A for forming a thick upper conductor layer on the upper surface of the substrate by printing and baking a metal organic paste, a lower electrode forming step B for forming a thick lower conductor layer on the lower surface of the substrate by printing and baking metal organic paste, and a resistor element forming step C for forming a thin resistor layer by depositing a resistor material on the upper surface of the substrate. Preferably, the upper and the lower surfaces of the material substrate are flat.

REFERENCES:
patent: 4806159 (1989-02-01), De Keyser et al.
patent: 5022263 (1991-06-01), Uriu et al.
patent: 5990781 (1999-11-01), Kambara
patent: 6172590 (2001-01-01), Shrier et al.
patent: 6-45118 (1994-02-01), None
patent: 7-147207 (1995-06-01), None
patent: 7-176412 (1995-07-01), None
patent: 9-69406 (1997-03-01), None

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