Method for controlling semiconductor processing apparatus

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C700S110000, C700S121000, C438S014000

Reexamination Certificate

active

07107115

ABSTRACT:
Occurrence of a process abnormality in a semiconductor processing apparatus is obtained by obtaining an index of a processing size of each of wafers within an X-th lot, in which the X represents an integer, based on data obtained during processing of each of the wafers of the X-th lot, obtaining an index of a processing size of each of wafers within an X+1-th lot, based on data thereof and anticipating an index of a processing sizes of each of wafers within an X+2-th lot, based on the index obtained as to each of the wafers of the X-th lot and the X+1-th lot. A process abnormality occurring during the processing of a wafer of the X+2-th lot is anticipated when the anticipated index of the X+2-th lot exceeds an allowance range.

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Barnett, T.S.; Singh, A.D.; Nelson, V.P., “Yield-reliability modeling for fault tolerant integrated circuits ,” Defect and Fault Tolerance in VLSI Systems, 2001. Proceedings. 2001 IEEE International Symposium on , vol., no.pp. 29-38, 2001.

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