Insert molding electronic devices

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Reexamination Certificate

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Details

C361S737000, C029S841000

Reexamination Certificate

active

07030316

ABSTRACT:
An apparatus and methods are provided for housing an electronic device. In one embodiment, an electronic device is positioned on a housing base and a housing lid is over-molded onto at least a portion of the base and the electronic device. An interface of the electronic device remains exposed for coupling to a second electronic device, and the housing base and housing lid form a housing partially encasing the electronic device. In another embodiment, an inset panel can be formed within the housing lid or base, for example, by positioning the panel and the electronic device within a housing base and over-molding a housing lid, while maintaining the inset panel substantially exposed. The inset panel can be formed from a material of a contrasting color to provide, for example, a label region on the housed electronic device.

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