Thin film forming apparatus and thin film forming method

Details Thin film forming apparatus and thin film forming method Thin film forming apparatus and thin film forming method

2006-03-28

2006-03-28

Edwards, Laura (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

C156S580000, C118S050000

Reexamination Certificate

active

07017637

ABSTRACT:
Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).

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