Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-03-07
2006-03-07
Paumen, Gary (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S071000
Reexamination Certificate
active
07008237
ABSTRACT:
A land grid array connector (10) for electrically connecting a CPU package to a printed circuit board includes a housing (30) having a top surface (320) and a number of terminals received in passageways (31) of the housing. Each of the terminals has a retention portion (52), a spring arm (54) extending from the retention portion beyond the top surface. A contacting portion (58) is formed on a topmost part of the spring arm for electrically mating with a corresponding pad formed on a bottom of the CPU package. A plurality of protrusions (324) is formed on the top surface for protect the terminals from being accidental damaged, A common supporting surface (326) is formed cooperatively by the protrusions, above the contacting portion in a direction perpendicular to the top surface. This can protect the contacting portion of the terminal from being collided. As a result reliable electrical connection between the package and contacts of the land grid array connector is secured.
REFERENCES:
patent: 6345987 (2002-02-01), Mori et al.
patent: 6604950 (2003-08-01), Maldonado et al.
patent: 6805561 (2004-10-01), Walkup et al.
patent: 6824396 (2004-11-01), Koopman et al.
patent: 6843659 (2005-01-01), Liao et al.
patent: 6908313 (2005-06-01), Walkup et al.
patent: 6921271 (2005-07-01), Liao et al.
Ma Hao-Yun
Szu Ming-Lun
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Paumen Gary
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