Electrolyte copper foil having carrier foil, manufacturing...

Details Electrolyte copper foil having carrier foil, manufacturing... Electrolyte copper foil having carrier foil, manufacturing...

2006-01-10

2006-01-10

Koehler, Robert R. (Department: 1775)

Stock material or miscellaneous articles

Composite

Of metal

C428S674000, C428S457000, C428S926000, C428S935000, C428S938000

Reexamination Certificate

active

06984453

ABSTRACT:
An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil1, which includes an adhesive interface layer4arranged on one face of the carrier foil2and an electrodeposited copper foil layer3arranged on the adhesive interface layer4, characterized in that the adhesive interface layer4is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.

REFERENCES:
patent: 2593829 (1952-04-01), Arledter et al.
patent: 960725 (1999-12-01), None
patent: 1133220 (2001-09-01), None
patent: 1133220 (2001-09-01), None
patent: 11-317574 (1999-11-01), None
patent: 2000-309898 (2000-11-01), None
patent: WO 01/21859 (2001-03-01), None

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