Circuit board and fabricating process thereof

Details Circuit board and fabricating process thereof Circuit board and fabricating process thereof

2006-01-03

2006-01-03

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000

Reexamination Certificate

active

06981320

ABSTRACT:
A circuit board and a fabricating process thereof is provided. The present invention employs a core layer as a base layer, wherein the core layer is a core conducting layer, or is a core dielectric layer having two conducting layers. By using this core layer and two patterned conductive layers, a three-conducting-layer circuit board or a four-conducting-layer circuit board is fabricated. Furthermore, both circuit boards can be used as circuit board units to fabricate circuit boards having more than four conducting layers. The present invention adopts lamination processes and equipment instead of using complicated build-up process. Therefore, the present invention effectively reduces the production costs and simplifies the process cycle for fabricating circuit boards, and is suitable for mass production.

REFERENCES:
patent: 4868350 (1989-09-01), Hoffarth et al.
patent: 5220723 (1993-06-01), Okada
patent: 5274912 (1994-01-01), Olenick et al.
patent: 5719354 (1998-02-01), Jester et al.
patent: 6344371 (2002-02-01), Fischer et al.
patent: 6618940 (2003-09-01), Lubert et al.
patent: 6834426 (2004-12-01), Japp et al.

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