Method and system for maintaining uniform module junction...

Details Method and system for maintaining uniform module junction... Method and system for maintaining uniform module junction...

2006-01-24

2006-01-24

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S760020, C324S763010

Reexamination Certificate

active

06989685

ABSTRACT:
A method for controlling the burn-in temperature of a semiconductor chip includes determining a DC current of the chip, and determining a difference between the DC current and a target current, the target current being selected to produce a desired chip temperature. An operating frequency of the chip is calculated, based on the determined difference between the DC current and the target current, so as generate an additional AC component of current to attain the target current.

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“What is burn-in?” found at http://www.burn-in.com/primer.htlm, (no month, year).
A.J. Abrami, R.C. Chu, D. L. Edwards, M.J. Ellsworth, S.R. Quigley and R.E. Simons; “TCM Thermal Reticle;” Research Disclosure, Feb. 1991, No. 322.

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