Solder pastes for providing high elasticity, low rigidity...

Details Solder pastes for providing high elasticity, low rigidity... Solder pastes for providing high elasticity, low rigidity...

2006-03-28

2006-03-28

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C228S248500, C148S023000

Reexamination Certificate

active

07017795

ABSTRACT:
Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.

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