Method of laser processing and head for ejecting droplet

Details Method of laser processing and head for ejecting droplet Method of laser processing and head for ejecting droplet

2006-07-04

2006-07-04

Tran, Huan (Department: 2861)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S065000, C347S020000

Reexamination Certificate

active

07070700

ABSTRACT:
A method of laser processing for processing a laminated member where a metal thin film is protruded from an end portion of a silicon substrate at the bottom of the silicon substrate, wherein; a laser beam of which wavelength has the light absorption coefficient of the metal thin film being higher than the light absorption coefficient of the silicon substrate, is irradiated onto an boundary between an end of the silicon substrate and the metal thin film so as to cut the metal thin film.

REFERENCES:
patent: 3790744 (1974-02-01), Bowen
patent: 3909582 (1975-09-01), Bowen
patent: 0 256 938 (1988-02-01), None
patent: 11-192701 (1999-07-01), None
Patent Abstract of Japan Publication No. 11-192701 Published Jul. 21, 1999.

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