Small format optoelectronic package

Details Small format optoelectronic package Small format optoelectronic package

2006-09-05

2006-09-05

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S081000, C257S680000, C257S684000, C257S080000, C257S098000, C257S100000, C372S036000, C372S043010, C372S050121, C372S092000, C372S049010

Reexamination Certificate

active

07102178

ABSTRACT:
An optoelectronic package (10) includes a base substrate (40), a plurality of solder pads (21) and a can (30). The base substrate includes a mounting seat (41) laminated first and second layer (421,422). The solder pads (21) respectively attach to a top surface (412) and a bottom surface (4212) of the base substrate and are electrically interconnected with each other via conductive material filled the through-holes (411,4223,4213) and conductor trace (45,45′). Optoelectronic components (not shown) are attached to the top surface of the base substrate and make electrical connection with the solder pads. The can includes a transparent device (31), an metal enclosure (32) and a housing (33), which hermetically seals to the base substrate protecting the optoelectronic components.

REFERENCES:
patent: 4567598 (1986-01-01), Noguchi et al.
patent: 6034424 (2000-03-01), Fujimura et al.
patent: 6163072 (2000-12-01), Tatoh
patent: 6556608 (2003-04-01), Gilliland et al.

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